Title:
回路基板の製造方法
Document Type and Number:
Japanese Patent JP6677379
Kind Code:
B2
Abstract:
The present specification relates to a manufacturing method of a circuit board. More particularly, the present specification relates to a circuit board and a manufacturing method of an electronic device including the same.
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Inventors:
Song, Yong Goo
Lee, Seung Heon
Theo, Han Min
Rim, Chang Yun
Mune, Ji Eun
Lee, Xeoku
Lee, Seung Heon
Theo, Han Min
Rim, Chang Yun
Mune, Ji Eun
Lee, Xeoku
Application Number:
JP2017567369A
Publication Date:
April 08, 2020
Filing Date:
January 04, 2017
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
H05B33/10; H01L51/50; H05B33/26; H05B33/28
Domestic Patent References:
| JP4055823A | ||||
| JP11160722A | ||||
| JP10082984A | ||||
| JP10068923A | ||||
| JP2014512075A |
Foreign References:
| US6252641 | ||||
| US20070013293 | ||||
| CN103107285A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation