Title:
CIRCUIT BOARD AND MOUNTING OF SURFACE MOUNTING-TYPE ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3619624
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the generation of a short-circuit between adjacent electrodes to realize the high density mounting of a circuit board by a method wherein projection parts, which are provided in the state corresponding to electrode terminals on a surface mounting-type electronic component, are provided in the front layer surface of a wiring board and the first electrodes are respectively formed on the points of the projection parts.
SOLUTION: A surface layer formation board 32, which is photosensitive and is tabular, is pasted on the board surface 14A of a multilayer interconnection board 14 by a curtain coating method, a dry film pasting method or the like. Thereby, projection parts 32B are respectively formed in each part, which is equivalent to each land 15 for dummy use, of the upper surface 32A of the board 32. With that, grooves 32C are respectively formed between the projection parts 32B. A copper (Cu) foil is etched on the upper surface 32A of the board 32 in the state corresponding to the layout pattern of each projection part 32B. Thereby, lands 32 are respectively formed on the projection parts 32B.
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Inventors:
Akihiko Okudo
Junko Araki
Junko Araki
Application Number:
JP28138996A
Publication Date:
February 09, 2005
Filing Date:
October 01, 1996
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/60; H01L23/12; H01L27/00; H05K3/32; H05K3/40; (IPC1-7): H01L23/12; H01L21/60
Domestic Patent References:
| JP63192244A | ||||
| JP521518A | ||||
| JP5152382A |
Attorney, Agent or Firm:
Keiki Tanabe
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