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Title:
CIRCUIT BOARD TO WHICH FPC SUBSTRATE IS CONNECTED, AND METHOD OF CONNECTING FPC SUBSTRATE AND CIRCUIT BOARD TOGETHER
Document Type and Number:
Japanese Patent JP2011129554
Kind Code:
A
Abstract:

To provide a circuit board to which an FPC substrate is connected, and to provide a method of connecting the FPC substrate and circuit board together such that an electric connection between a connection terminal of the circuit board and a connection terminal of the FPC substrate can be made accurately and speedily without providing any alignment mark.

At least two of connection terminals 20 of the circuit board 15 are made longer in length than other connection terminals 20 to protrude to a wiring formation part side of the circuit board 15 to have surfaces thereof exposed as dummy connection terminals 20a, and the exposed parts of the dummy connection terminals 20 are used as marks to align corresponding connection terminals 24 of the FPC substrate 12 which can be easily viewed in plan view with the dummy connection terminals 20a in plan view.


Inventors:
MORIMOTO KENGO
TAMURA MASANORI
Application Number:
JP2009283726A
Publication Date:
June 30, 2011
Filing Date:
December 15, 2009
Export Citation:
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Assignee:
EPSON IMAGING DEVICES CORP
International Classes:
H05K1/14; G09F9/00; G09F9/30; H05K1/11; H05K3/36
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka