Title:
CIRCUIT BODY AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2019133974
Kind Code:
A
Abstract:
To provide a circuit body and a manufacturing method thereof which can directly form a shield circuit on a wiring surface.SOLUTION: A circuit body 1 includes a bottom shield layer 31 formed on a routing surface 21, a bottom insulating layer 41 formed so as to be superimposed on the bottom shield layer, a conductor 5 superimposed on the bottom insulating layer, a covering insulating layer 42 constituting an inner insulating layer 4 covering the conductor together with the bottom insulating layer, a covering shield layer 32 formed so as to superimposed on the inner insulating layer and constituting a shield 3 that covers the inner insulating layer together with the bottom shield layer, and an outer insulating layer 6 formed so as to be superimposed on the shield and covering the shield together with the routing surface.SELECTED DRAWING: Figure 1
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Inventors:
NOMURA SHOICHI
YAMAGUCHI TORU
MIZOBUCHI MASATOSHI
KAWAKAMI HIROKI
OSHITA CHIKAFUMI
FURUTA HIROSHI
YAMAGUCHI TORU
MIZOBUCHI MASATOSHI
KAWAKAMI HIROKI
OSHITA CHIKAFUMI
FURUTA HIROSHI
Application Number:
JP2018012290A
Publication Date:
August 08, 2019
Filing Date:
January 29, 2018
Export Citation:
Assignee:
YAZAKI CORP
TOYOTA MOTOR CORP
TOYOTA MOTOR CORP
International Classes:
H05K3/10; H05K3/12; H05K9/00
Domestic Patent References:
| JPH05160575A | 1993-06-25 | |||
| JPH04139799A | 1992-05-13 | |||
| JP2012243857A | 2012-12-10 | |||
| JPH0660165U | 1994-08-19 | |||
| JP2010029033A | 2010-02-04 | |||
| JPH11215651A | 1999-08-06 |
Attorney, Agent or Firm:
Toranomon Intellectual Property Office