Title:
CIRCUIT-CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT TERMINAL, AND METHOD FOR CONNECTING CIRCUIT TERMINAL
Document Type and Number:
Japanese Patent JP2007224228
Kind Code:
A
Abstract:
To provide a circuit-connecting material having flexibility without adding an acrylic rubber.
The circuit-connecting material is interposed between opposed circuit electrodes 1a and 2a to pressurize the opposed circuit electrodes 1a and 2a and electrically connect the electrodes 1a and 2a in the direction of pressurization. The circuit-connecting material comprises (1) an epoxy resin, (2) an anion polymerization curing agent, (3) a radically polymerizable substance, and (4) a curing agent which generates a free radical, as essential ingredients, and does not contain an acrylic rubber.
COPYRIGHT: (C)2007,JPO&INPIT
Inventors:
NAKAZAWA TAKASHI
FUJINAWA MITSUGI
FUJINAWA MITSUGI
Application Number:
JP2006049624A
Publication Date:
September 06, 2007
Filing Date:
February 27, 2006
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J163/00; C09J11/00; H01B5/16; H01L21/60
Domestic Patent References:
| JPH11191320A | 1999-07-13 | |||
| JP2005235530A | 2005-09-02 | |||
| JP2005325161A | 2005-11-24 | |||
| JPH10168412A | 1998-06-23 | |||
| JP2002285135A | 2002-10-03 | |||
| JP2002367692A | 2002-12-20 |
Attorney, Agent or Firm:
Kihei Watanabe