Title:
Circuit connection material, a connection structure using it
Document Type and Number:
Japanese Patent JP5944102
Kind Code:
B2
Abstract:
Provided is a circuit connection material that electrically connects opposing circuit electrodes. Said circuit connection material contains a thermoplastic polymer that contains: (a) an epoxy resin; (b) a latent hardener; (c) a film-forming material; and (d) a monomer unit, namely a carboxylic acid vinyl ester.
Inventors:
Takashi Nakazawa
Koji Kobayashi
Takanobu Kobayashi
Koji Kobayashi
Takanobu Kobayashi
Application Number:
JP2010548314A
Publication Date:
July 05, 2016
Filing Date:
November 16, 2010
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J163/00; C09J7/02; C09J9/02; C09J11/06; C09J11/08; C09J131/04; H01B5/16; H05K1/14; H05K3/32
Domestic Patent References:
| JPH0316147A | 1991-01-24 | |||
| JP2008111092A | 2008-05-15 | |||
| JPH0316147A | 1991-01-24 | |||
| JP2008111092A | 2008-05-15 | |||
| JPH0790237A | 1995-04-04 | |||
| JPH05279646A | 1993-10-26 | |||
| JP2009161684A | 2009-07-23 |
Foreign References:
| WO2009054410A1 | 2009-04-30 | |||
| WO2007099965A1 | 2007-09-07 | |||
| WO2008084811A1 | 2008-07-17 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Tomoya Furoshita
Hiroto Kido
Masato Ikeda
Yoshinori Shimizu
Tomoya Furoshita
Hiroto Kido
Masato Ikeda