Title:
CIRCUIT MODULE AND METHOD OF MOUNTING THE SAME
Document Type and Number:
Japanese Patent JP2011077140
Kind Code:
A
Abstract:
To provide a terminal structure capable of reducing a stress applied to a solder fillet bonding a circuit module to a mounting board, preventing a bonding failure, and achieving a reliable mounting, when the circuit module is mounted on the mounting board.
The circuit module includes a circuit board 10 having at least first and second surfaces, an element chip 20 mounted on the first surface, and a terminal (terminal electrode) 30 for mounting, which is formed on the second surface of the circuit board serving as a mounting surface in a projecting manner, wherein the terminal 30 has cross-sectionally symmetric recesses serving as solder pools.
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Inventors:
KOBAYASHI MITSURU
TATSUTA ATSUSHI
TATSUTA ATSUSHI
Application Number:
JP2009224693A
Publication Date:
April 14, 2011
Filing Date:
September 29, 2009
Export Citation:
Assignee:
PANASONIC ELEC WORKS CO LTD
International Classes:
H05K1/14; H01L21/60; H01L23/12; H05K1/18; H01R4/02
Attorney, Agent or Firm:
Shohei Oguri
Toshimitsu Ichikawa
Kimihide Hashimoto
Toshimitsu Ichikawa
Kimihide Hashimoto
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