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Title:
CIRCUIT UNIT, CIRCUIT STRUCTURE, AND METHOD OF MANUFACTURING THE CIRCUIT UNIT
Document Type and Number:
Japanese Patent JP2010199221
Kind Code:
A
Abstract:

To provide a circuit unit that achieves improvement in position accuracy, a circuit structure, and a method of manufacturing the circuit unit.

The circuit unit 50 includes a first conductive member 22 and a second conductive member 32 stacked on the first conductive member 22 via a first insulating resin member 33. The first conductive member 22 is formed with a first engaging part 31 for executing positioning between a lower die 40 and the first conductive member 22 by engagement with the lower die 40. The second conductive member 32 has a second engaging part 36 that is formed at a position near the first engaging part 31 while the second conductive member is being stacked on the first conductive member 22 in order to execute positioning between the lower die 40 and the second conductive member 32 by engagement with the lower die 40.


Inventors:
CHIN NOBORU
FUKUYAMA MINORU
YAMANE SHIGEKI
MAEDA HIROTOSHI
MIZUNO TAKEHIRO
Application Number:
JP2009040988A
Publication Date:
September 09, 2010
Filing Date:
February 24, 2009
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H05K1/02; H05K3/00; H05K3/20
Domestic Patent References:
JP2002134870A2002-05-10
JPH034595A1991-01-10
Attorney, Agent or Firm:
Akatsuki Joint Patent Office