Title:
化学機械平坦化(CMP)後の洗浄組成物
Document Type and Number:
Japanese Patent JP2004518819
Kind Code:
A
Abstract:
A cleaning solution for cleaning microelectronic substrates, particularly for post-CMP or via formation cleaning. The cleaning solution comprises a quaternary ammonium hydroxide, an organic amine, a corrosion inhibitor, optionally an organic acid, and water. A preferred cleaning solution comprises tetramethylammonium hydroxide, monoethylanolamine, gallic acid ascorbic acid, and water with the alkalinity of the cleaning solution greater then 0.073 milliequivalents base per gram of solution.
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Inventors:
Nagsineh, Charlie
Jeff Burns
Oldak, Ewaby.
Jeff Burns
Oldak, Ewaby.
Application Number:
JP2002564755A
Publication Date:
June 24, 2004
Filing Date:
February 06, 2002
Export Citation:
Assignee:
ESC, Inc.
International Classes:
C11D1/62; C11D3/00; C11D3/20; C11D3/28; C11D3/30; C11D7/26; C11D7/32; C11D11/00; C11D17/08; C23G1/18; C23G1/20; G03F7/42; H01L21/02; H01L21/3105; H01L21/311; H01L21/321; H01L21/316; (IPC1-7): C23G1/18; C11D7/26; C11D7/32; C11D17/08; C23G1/20
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita