Title:
CLEANING MEMBER FOR SEMICONDUCTOR TEST DEVICE, SEMICONDUCTOR MANUFACTURING APPARATUS, AND SEMICONDUCTOR TEST SYSTEM
Document Type and Number:
Japanese Patent JP2006153673
Kind Code:
A
Abstract:
To perform automatic cleaning of contact pins of a test device.
The cleaning member 50 used in the semiconductor manufacturing apparatus transfers the semiconductor device 30 to the test device (or test process) 20 by vacuum chucking is composed of a cleaning part 52 for cleaning the contact part, and a vacuum chucking part 51 for being chucked by the semiconductor manufacturing apparatus. The cleaning member performs the cleaning of the contact part by being transferred to the test device.
Inventors:
TAKATSUKA KENJI
TAKAHASHI HIROSHI
TAKAHASHI HIROSHI
Application Number:
JP2004345022A
Publication Date:
June 15, 2006
Filing Date:
November 29, 2004
Export Citation:
Assignee:
APIC YAMADA CORP
International Classes:
G01R31/26; G01R1/06
Attorney, Agent or Firm:
Ryosuke Fujimoto
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