Title:
CLEANING PROCESS APPARATUS
Document Type and Number:
Japanese Patent JP3782298
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a cleaning process apparatus which can prevent operational failures of a driving system, due to flying of the cleaning liquid to the driving system and can keep the apparatus inside clean, by preventing flying of particles generated in the driving system to the wafer to be cleaned.
SOLUTION: This cleaning process apparatus for applying a cleaning process to a substrate, such as a semiconductor wafer, for instance, a scrub cleaning unit (SCR) 21a, is provided with a spin chuck 71, which is a holding means for holding a wafer W in an almost horizontal plane and rotating the wafer in the plane; a cup 73 installed surrounding the spin chuck 71; cleaning means such as brushes 76a, 76b that clean the upper surface of the wafer held by the spin chuck 71; brush-holding arms 77a, 77b that hold the bushes 76a, 76b; and arm driving mechanisms 79a, 79b that drive the brush holding arms 77a, 77b, so that the brushes 76a, 76b move on prescribed positions of the wafer W held by the spin chuck 71. A partition wall 98 is installed between the installed section of the cup 73 (a cleaning process room 82) and the installed section of the arm driving mechanisms 79a, 79b (a driving mechanism installation chamber 82b), to separate the both.
Inventors:
Akira Ishihara
Application Number:
JP2000325641A
Publication Date:
June 07, 2006
Filing Date:
October 25, 2000
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B08B1/04; B08B3/02; H01L21/304; B08B7/04; (IPC1-7): H01L21/304; B08B1/04; B08B3/02; B08B7/04
Domestic Patent References:
| JP11354480A | ||||
| JP7283180A | ||||
| JP2000070875A | ||||
| JP2000058426A |
Attorney, Agent or Firm:
Hiroshi Takayama
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