Title:
FILM-FORMING STRUCTURE FOR WORKPIECE AND FILM-FORMING METHOD FOR WORKPIECE
Document Type and Number:
Japanese Patent JP2017001312
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a film-forming structure and a film-forming method for a workpiece, comprising closely depositing a soft and thin primary film on a workpiece, the primary film being a suboxide or an oxide and having insulation properties and corrosion resistance, wherein: the workpiece is integrated with the primary film to prevent the primary film from peeling, thereby improving the workability; the thin secondary film such as a coating is attached to the primary film closely, thereby reducing the amount of paint used; and the primary film is integrated with the secondary film to prevent the secondary film from peeling, thereby improving workability after forming the secondary film, and thereby forming the primary and secondary films rationally.SOLUTION: In a film-forming structure for a workpiece 3, a film is formed on a surface of the workpiece, wherein on the surface of the workpiece 3, a thin primary film 23 is deposited which consists of a suboxide or oxide including a metal. The primary film 23 is formed to be a porous film.SELECTED DRAWING: Figure 9
Inventors:
YOSHIDA HIDEO
SUYAMA YASUHIRO
SUYAMA YASUHIRO
Application Number:
JP2015118459A
Publication Date:
January 05, 2017
Filing Date:
June 11, 2015
Export Citation:
Assignee:
YOSHIDA HIDEO
International Classes:
B32B9/00; B05D3/10; B05D7/24; B32B5/18; C23C28/00; C25D11/38
Domestic Patent References:
| JP2011201285A | 2011-10-13 | |||
| JP2012135723A | 2012-07-19 | |||
| JP2012218291A | 2012-11-12 | |||
| JP2012217983A | 2012-11-12 | |||
| JP2005126769A | 2005-05-19 | |||
| JP2004263237A | 2004-09-24 | |||
| JPS55152171A | 1980-11-27 |
Attorney, Agent or Firm:
Takeshi Chiaki
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