To form a fluid film with uniform thickness on the surface of a substrate by installing a holding stand for holding the substrate in a freely rotatable manner and using a filter part made of a porous medium and a sealing member practically closely attached to the filter part and made freely openable for constituting an enclosure formed on the holding stand.

In a resist application apparatus, a reticle substrate 13 is held on a holding stand 12 to be rotated at high speed by a motor 11 and an enclosure 14 is formed on the holding stand 12. A ventilation control constitution 250 is installed on the enclosure 14 and the ventilation control constitution 250 is constituted of a frame part 25 for holding a porous filter 25A and a cover 26 so installed as to be practically closely attached to the porous filter 25A. The cover 26 formed as to be freely detachable from the frame part 25. The enclosure 14 and the ventilation control constitution 250 are unitedly rotated with a substrate 13 when the holding stand 12 is rotated to rotate also the air enclosed in the enclosure 14, so that the film thickness of a resist film in corner parts of the substrate 13 is prevented from becoming thick.