Title:
COATING FILM PEELING DEVICE, AND METHOD OF PEELING COATING FILM OF CONDUCTIVE WIRE
Document Type and Number:
Japanese Patent JP2023061191
Kind Code:
A
Abstract:
To provide a coating film peeling device capable of surely peeling an insulating coating film of a conductive wire, and to provide a method of peeling a coating film of the conductive wire thereof.SOLUTION: A coating film peeling device 3 according to the present disclosure comprises, in the coating film peeling device 3 for peeling an insulating coating film of a conductive wire 21 extending in one direction, a peeling blade tool 6 for peeling the insulating coating film in a case of being in contact with the conductive wire 21, a linear motion member 37 that is reciprocally movable along the one direction, a member driver 36 for moving or resting the linear motion member 37, and a converter 5 that transmits motion of the linear motion member 37 to the peeling blade tool 6 by being converted into motion in a direction coming into contact/separating with/from the conductive wire 21 by the peeling blade tool 6.SELECTED DRAWING: Figure 3
Inventors:
SHIONO HIROTO
TAKAHASHI YUTA
HAYASHI HIROKI
TAKAHASHI YUTA
HAYASHI HIROKI
Application Number:
JP2021171035A
Publication Date:
May 01, 2023
Filing Date:
October 19, 2021
Export Citation:
Assignee:
DAIHEN CORP
International Classes:
H02G1/12; B26B27/00; B26D3/00; H01F41/04; H01F41/076; H01F41/10
Attorney, Agent or Firm:
Hidehito Kono
Tono Kono
Tono Kono