Title:
複合体とその製造方法
Document Type and Number:
Japanese Patent JP6584399
Kind Code:
B2
Abstract:
A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 μm and the area of a volumetric distribution of particle sizes of 45-205 μm is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.
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Inventors:
Yosuke Ishihara
Takeshi Miyagawa
Shinya Narita
Takeshi Miyagawa
Shinya Narita
Application Number:
JP2016531468A
Publication Date:
October 02, 2019
Filing Date:
July 03, 2015
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
C22C26/00; B22F1/08; B22F1/12; C22C1/05; C23C28/02; H01L23/373; B22F1/10
Domestic Patent References:
| JP2012117085A |
Foreign References:
| WO2013015158A1 | ||||
| WO2010007974A1 | ||||
| US20120063071 |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation