COMPONENT HAVING SOLDER LAYER - SUMITOMO METAL SMI ELECTRON DE

Title:

COMPONENT HAVING SOLDER LAYER

Document Type and Number:

Japanese Patent JPH11126848

Kind Code:

A

Abstract:

To inhibit irregularities in the solder feasibility of the solder layer of a ceramic lid and moreover, to make the solder fusing temperature of the solder layer low by a method wherein the ceramic lid is formed into one having the solder layer, which consists of a PB-AG-As solder and dardly precipitates Ag-Sn crystals in the surface thereof.

A ceramic lid 11 having a solder layer 17, having no Ag-Sn crystal precipitated in at least the surface thereof is selected from a ceramic lid 11, in a ceramic lid mixed precipitated Ag-Sn crystal therein and a non- precipitated Ag-Sn crystal therein. A cavity part 20 of a package base body 18 is sealed, using only the selected ceramic lid 11. In such a way, by limiting the lid 11 used for the sealing of the cavity part 20 to the lid 11 only having the layer 17 which is not precipitated the Ag-As crystal in the surface thereof, irregularities in the solder fusaibility of the solder layer of the ceramic lid 11 can be inhibited. Accordingly, the enhancement of the yield of the sealing of the cavity part 20 can be contrived.

Inventors:

YOSHINO HIDEYUKI
YAMAMOTO TETSUYA
NISHI YUICHIRO

Application Number:

JP29078497A

Publication Date:

May 11, 1999

Filing Date:

October 23, 1997

Export Citation:

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Assignee:

SUMITOMO METAL SMI ELECTRON DE

International Classes:

B23K35/26; H01L23/08; H01L23/10; (IPC1-7): H01L23/10; B23K35/26; H01L23/08

Attorney, Agent or Firm:

Ryuji Inouchi

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