To provide a component mounting device capable of mounting multiple kinds of components by one mounting unit at a high throughput.
A component mounting device 100 for mounting plural kinds of components supplied from a component supply section 101 to a printed circuit board 108 has a component mounting head 104 that can move above a region including the component supply section 101 and the printed circuit board 108 and has plural component mounting nozzle sets 105. Each component mounting nozzle set 105 can independently move to the component mounting head 104 in a first direction for connecting the component supply section 101 and a printed circuit board conveying path 107 and in a direction orthogonal to the first direction. The component mounting head 104 independently moves and positions each component mounting nozzle set 105 while a position of the component mounting head 104 is fixed to plural predetermined positions on the printed circuit board 108 at one mounting cycle for each component adsorbed from the component supply section 101, so as to mount each component.
NAKADA TERUO
OKAMOTO MANABU
| JP2002176291A | 2002-06-21 | |||
| JP2003218589A | 2003-07-31 |
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