Title:
部品実装機
Document Type and Number:
Japanese Patent JP7426800
Kind Code:
B2
Abstract:
To provide a technique for moving internal units, while suppressing an increase in the size of a device.SOLUTION: A component mounting device mounts electronic components onto a substrate. The component mounting device comprises: one or more internal units whose installation locations are fixed during the mounting of the electronic components onto the substrate, and which are not disposed between a pair of conveyors for conveying the substrate; a movable part which is separate from the internal units and is movable relative to the internal units, and which has a moving mechanism for moving the internal units from the installation locations; and a control part, for controlling the movement of the movable part and the operation of the moving mechanism, which moves the internal units from the installation locations by moving the movable part and, at the same time, operating the moving mechanism.SELECTED DRAWING: Figure 1
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Inventors:
畔▲柳▼ 光孝
Kazuya Matsuyama
Riki Tanizawa
Shingo Aoki
Kazuya Matsuyama
Riki Tanizawa
Shingo Aoki
Application Number:
JP2019188015A
Publication Date:
February 02, 2024
Filing Date:
October 11, 2019
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/08
Domestic Patent References:
| JP4263499A |
Foreign References:
| WO2021057603A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Kaiyu International Patent Office