To provide a component mounting system and a component mounting method capable of achieving the object of a component mounting work with sufficient accuracy even when a substrate has a deformation, e.g. warpage or distortion.
A printer 11 images a substrate mark 2m and each land 3 provided on a substrate 2 by means of a land imaging camera 25, creates the actual measurement position data of each land 3 with reference to the position of the substrate mark 2m based on the imaging results, and then transmits the actual measurement position data of each land 3 thus created to a component mounting machine 13 on the downstream process side. After imaging the substrate mark 2m and each land 3 provided on the substrate 2, the printer 11 performs printing of paste Pt onto each land 3 on the substrate 2, and the component mounting machine 13 mounts a component 4 at the position of each land 3 on the substrate 2 determined from the actual measurement position data of each land 3 created by the printer 11, for the substrate 2 on which the printer 11 has performed printing of the paste Pt.
INOUE MASAFUMI
TOMOMATSU MICHINORI
HASSAKU YOSUKE
| JP2001232757A | 2001-08-28 | |||
| JP2003163449A | 2003-06-06 | |||
| JPH05102698A | 1993-04-23 |
Daisuke Nagano
Kentaro Fujii
Next Patent: COMPONENT MOUNTING SYSTEM AND COMPONENT MOUNTING METHOD