Title:
COMPOSITE COPPER FOIL EQUIPPED WITH COPPER OR COPPER-ALLOY SUBSTRATE AND PRINTED BOARD USING THE FOIL
Document Type and Number:
Japanese Patent JP3854207
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent adhesion of contaminants, such as the resin powder etc., of a prepreg sheet to the surface of composite copper foil by improving the handleablity of extremely thin copper foil and, in addition, to prevent the foil from being scratched or marked by foreign matters and the occurrence of scratches, mixture of foreign matters, wrinkles, and break, and so on, while the foil is packed and transported.
SOLUTION: The composite copper foil equipped with a copper or copper-alloy substrate and a printed board using the copper foil have nickel layers covered with oxide films on the substrate sides between the copper or copper-alloy substrates and extremely thin copper foil, and benzotriazole coating layers between the nickel layers covered with the oxide films and extremely thin copper foil.
Inventors:
Naoshi Michishita
Mikio Hanafusa
Mikio Hanafusa
Application Number:
JP2002260908A
Publication Date:
December 06, 2006
Filing Date:
September 06, 2002
Export Citation:
Assignee:
Nikko Metal Co., Ltd.
International Classes:
H05K1/09; B32B9/00; B32B15/04; C25D1/04; C25D1/20; C25D7/00; H05K3/00; (IPC1-7): H05K1/09; B32B9/00; B32B15/04; C25D1/04; C25D1/20; C25D7/00; H05K3/00
Domestic Patent References:
| JP5318329B2 | ||||
| JP3073338A | ||||
| JP57020347A | ||||
| JP9228075A | ||||
| JP8181432A |
Attorney, Agent or Firm:
Isamu Ogoshi
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