Title:
複合電子部品及びその実装基板
Document Type and Number:
Japanese Patent JP7460064
Kind Code:
B2
Abstract:
A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.
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Inventors:
Song, Su Huang
Kim, Jung Duck
John, De Heon
Kim, Ho Young
Kim, Jung Duck
John, De Heon
Kim, Ho Young
Application Number:
JP2018109049A
Publication Date:
April 02, 2024
Filing Date:
June 06, 2018
Export Citation:
Assignee:
Samsung Electro-Mechanics Company Limited.
International Classes:
H01G4/40; H01G2/06; H01G4/30
Domestic Patent References:
| JP2012043947A | ||||
| JP2014187315A | ||||
| JP62124835U | ||||
| JP2015050453A |
Foreign References:
| CN104810152A |
Attorney, Agent or Firm:
Patent Attorney Corporation RYUKA International Patent Office