Title:
COMPOSITE LEAD FRAME
Document Type and Number:
Japanese Patent JP3013133
Kind Code:
B2
Abstract:
PURPOSE: To perform the wire bonding of a lead frame having an extra-large number of pins stably and at a high speed without deforming the inner lead parts to obtain a composite lead frame whose temperature rise in operation is suppressed.
CONSTITUTION: The plate thicknesses of the inner leads 1 or the tip parts of the inner leads 1 of a lead frame are smaller than those of the other parts. The tip parts of the inner leads are arranged into zigzag formations and wide parts are provided on the tip parts. A heating plate 12 or an independent pad 2 is fixed to the thin parts of the inner leads with insulating adhesives therebetween to support the inner leads.
Inventors:
Hirotaka Ueda
Riki Araki
Saburo Tanabe
Riki Araki
Saburo Tanabe
Application Number:
JP28193393A
Publication Date:
February 28, 2000
Filing Date:
October 14, 1993
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP4162469A | ||||
| JP3219663A |
Attorney, Agent or Firm:
Takahisa Kimura