Title:
COMPOSITE MOLDING AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JP2949554
Kind Code:
B2
Abstract:
PURPOSE: To obtain a polyaniline/polyimide composite molding excellent in heat resistance, strengths, etc., by heat-treating a molding of a polyaniline/ polyamic acid complex salt type precursor comprising a specified polyaniline and a specified polamic acid.
CONSTITUTION: A molding of a polyaniline/polyamic acid complex salt-type precursor comprising a polyaniline comprising structural units of formula I (wherein m and n are each 0 or greater; m/(n+m)=0-1; and m+n=10-5000) and having a number-average molecular weight of 2000-500000 and a polyamic acid represented by formula II (wherein Ar1 is a tetravalent aromatic-ring- containing group; Ar2 is a bivalent aromatic-ring-containing group; and k is 5-500) and having a number-average molecular weight of 1000-50000 is heat- treated to obtain a polyaniline/polyimide composite molding comprising a polyaniline of formula I and a polyimide of formula III. When doped with an acceptor dopant, this moling can show a dielectric constant as high as about 10-3 to 10S/cm.
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Inventors:
OKA OSAMU
Application Number:
JP25631693A
Publication Date:
September 13, 1999
Filing Date:
September 21, 1993
Export Citation:
Assignee:
TOMOEGAWA SEISHIJO KK
International Classes:
C08J5/00; C08L79/00; C08L79/08; (IPC1-7): C08L79/00; C08J5/00; C08L79/08
Domestic Patent References:
| JP60148012A | ||||
| JP364369A | ||||
| JP2500288A |
Attorney, Agent or Firm:
Tsuyoshi Watanabe
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