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Title:
COMPOSITE RESIN MATERIAL PARTICLE AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2010189621
Kind Code:
A
Abstract:

To provide a composite resin material particle which is produced by using a small amount of an electroconductive nanomaterial and which can be used for producing a molding having higher electroconductivity when molded.

The composite resin material particle has a dispersed/mixed layer in which the electroconductive nanomaterial is buried dispersedly and firmly from the surface of a resin material particle toward the inside thereof. The dispersed/mixed layer has electroconductivity. When the composite resin material particle is molded to form the molding, an electroconductive network is formed in the molding to impart electroconductivity to the molding. The method for producing the composite resin material particle comprises the steps of: packing the resin material particle and the electroconductive nanomaterial in a pressure vessel together with liquid carbon dioxide and a solvent for transmitting an ultrasonic wave; and dispersing/mixing the electroconductive nanomaterial from the surface of the resin material particle toward the inside thereof by using the ultrasonic wave.


Inventors:
YAJIMA TAKASHI
OTA HIDETOSHI
NOSE NORIHIRO
Application Number:
JP2009282320A
Publication Date:
September 02, 2010
Filing Date:
December 12, 2009
Export Citation:
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Assignee:
TAIYO NIPPON SANSO CORP
International Classes:
C08K3/04; C08J3/12; C08L101/00
Domestic Patent References:
JP2006008945A2006-01-12
JP2000511245A2000-08-29
JPH05234417A1993-09-10
JP2009109910A2009-05-21
Attorney, Agent or Firm:
Hisami Miki