To provide a composite resin molded product, which is suitable for obtaining a multilayer circuit board allowing formation of a high-density wiring pattern and excellent laser processed shapes, excellent in low linear expansion, flame retardancy, and surface smoothness of an insulating layer, and scarcely produces toxic substances in incineration, for an electrical insulating layer.

The composite resin molded product is produced by impregnating a fibrous base material having a fiber diameter of 0.05-2 m with a curable resin composition comprising a polymer A, which has weight-average molecular weight of 10,000-250,000, a carboxyl group or acid anhydride group, and an acid value of 5-200 mgKOH/g, and a curing agent B. Preferably, the polymer A is an alicyclic olefin polymer.