Title:
COMPOSITION COMPRISING POLYTHIOPHENE AND ORGANIC SOLVENT, AND USE THEREOF
Document Type and Number:
Japanese Patent JP2022152092
Kind Code:
A
Abstract:
To provide a polythiophene and organic solvent composition that can form a micron-level coating having excellent conductivity and no cracks.SOLUTION: Provided is a composition, which is a composition comprising a polythiophene that contains a structural unit represented by formula (1), a solvent (A) having a normal boiling point of 30 to 150°C, and a solvent (B) having a normal boiling point of 150 to 300°C, and in which, characterized, the contained amount of polythiophene is 0.01 to 25 mass%, the contained amount of the solvent (A) having a normal boiling point of 30 to 150°C is 50 to 99 mass%, and the contained amount of the solvent (B) having a normal boiling point of 150 to 300°C is 0.5 to 30 mass%.SELECTED DRAWING: None
Inventors:
HAYASHI SADAYOSHI
Application Number:
JP2021054736A
Publication Date:
October 12, 2022
Filing Date:
March 29, 2021
Export Citation:
Assignee:
TOSOH CORP
International Classes:
C08L65/00; C08G61/12
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