COMPOSITION CONTAINING MODIFIED POLYAMIDE EPOXY RESIN, AND ADHESIVE AND FILM USING THE SAME

Japanese Patent JP3888554

B2

PROBLEM TO BE SOLVED: To obtain a composition giving sufficient adhesive strength in low temperature contact bonding at ≤20°C and excellent in chemical resistance, soldering heat resistance, processability, and the like, and to provide an adhesive and an adhesive film using the composition.
SOLUTION: A modified polyamide epoxy resin is obtained by reacting (I) an acid terminal polyamide resin with (II) an epoxy resin at ≥1 molar ratio of epoxy groups/carboxyl groups, wherein the acid terminal polyamide resin is prepared by reacting (A) dicarboxylic acids with (B) an organic diisocyanate at >1 molar ratio of the carboxyl groups/the isocyanate groups, which dicarboxylic acids contain (a) a both terminal carboxylic acid compound having a polyalkylene glycol residue or a polycarbonate diol residue and (b) an aliphatic or aromatic polycarboxylic acid. The above composition comprises the modified polyamide epoxy resin, an epoxy resin and an epoxy resin-curing agent. The adhesive and the adhesive film are obtained by using the composition.

JP3106154	[Title of Invention] Polyisocyanate composition
JPH06256456	THERMOSETTING RESIN COMPOSITION

Takao Hirayama
Toshihiko Ito
Yoshiyuki Mukaiyama
Hiroaki Hirakura
Hiroshi Nishizawa
Ken Nanami
Kiyoshi Hirosawa

JP2004229308A

March 07, 2007

August 05, 2004

Click for automatic bibliography generation  

Hitachi Chemical Co., Ltd.

C08G18/65; C08L63/00; C08G18/44; C08G18/48; C08G59/02; C08G59/14; C08G59/20; C08G69/48; C08J5/18; C09J11/00; C09J163/00; C09J175/04; (IPC1-7): C08G59/14; C08G18/65; C09J11/00; C09J163/00; C09J175/04

JP8193119A
JP5295081A
JP5051571A
JP5051447A
JP2022319A

Previous Patent: IMAGING APPARATUS

Next Patent: POSITION CONTROL DEVICE AND METHOD