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Patent Searching and Data


Title:
COMPOSITION FOR COVERING
Document Type and Number:
Japanese Patent JPH11323185
Kind Code:
A
Abstract:

To provide a composition the cured material of which has excellent adhesion to a substrate and adhesion strength and exhibits excellent effects of preventing the attack and growth of fungi or the like and still further maintains the effects for a prolonged period of time.

A composition for covering comprises (A) a polymer comprising a (meth)acrylate as an essential constituent monomer unit, (B) a zeolite carrying a basic copper thereon, (C) a cement and (D) water, wherein the content of the component B is 2-30 wt.% of the composition and the content of the component C is not less than 100 pts.wt. per 100 pts.wt. of the component A.


Inventors:
TAKEDA SHINJI
FUKUSHIMA KOICHI
Application Number:
JP15355998A
Publication Date:
November 26, 1999
Filing Date:
May 18, 1998
Export Citation:
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Assignee:
TOAGOSEI CO LTD
International Classes:
C04B28/02; C04B41/65; C09D1/08; C09D5/16; C09D133/06; (IPC1-7): C09D1/08; C04B28/02; C04B41/65; C09D5/16; C09D133/06