COMPOSITION FOR FORMING PATTERN AND PATTERN FORMING METHOD

Title:

COMPOSITION FOR FORMING PATTERN AND PATTERN FORMING METHOD

Document Type and Number:

Japanese Patent JP2023158014

Kind Code:

A

Abstract:

To provide a composition for forming a pattern, from which a film for forming a pattern showing excellent etching processability can be formed.SOLUTION: A composition for forming a pattern is a composition for forming a pattern comprising a polymer, and satisfies the condition of 2≤Pr/Mr≤3.3, where Pr represents the free volume radius of the polymer and Mr represents the nuclear radius of metal introduced upon forming a pattern from the composition for forming a pattern.SELECTED DRAWING: Figure 1

More Like This:

JPH07199462	PHOTOSENSITIVE MATERIAL AND METHOD FOR FORMING COLORED IMAGE
JP2004151230	PHOTOSENSITIVE ELEMENT, METHOD FOR MANUFACTURING PHOTOSENSITIVE ELEMENT, METHOD FOR MANUFACTURING RESIST PATTERN USING THE SAME, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
WO/2023/008149	COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR FORMING RESIST UNDERLAYER FILM

Inventors:

TANAKA HIROKI
TANAKA YASUAKI

Application Number:

JP2023137001A

Publication Date:

October 26, 2023

Filing Date:

August 25, 2023

Export Citation:

Click for automatic bibliography generation Help

Assignee:

OJI HOLDINGS CORP

International Classes:

G03F7/11; C08F22/20

Attorney, Agent or Firm:

Sykes Patent Attorney Corporation

Previous Patent: Ni-Zn-Cu ferrite powder, sintered body, ferrite sheet

Next Patent: Time gating 3D imaging