PURPOSE: To provide a fluid composition which is suitable for producing gold seed layers by firing on a ceramic substrate, contains a gold resinate, a resin binder and a fluid vehicle, and contains ≥1% of a glass forming resinate and can produce the gold seed layers which retain high adhesion to a substrate even after prolonged exposure to elevated temperatures.

CONSTITUTION: The fluid composition contains an organogold compound, a resin derivative and a fluid vehicle. When the composition is applied onto the substrate and is fired thereon, the composition is thermally decomposed to form a substantially gold seed layers suitable for manufacturing an electric circuit on the substrate. The seed layer can retain adhesion of at least 30% of original adhesion after 500 hours at 175°C and contains at least 1 wt.% of resinate glass formed body by being added. The resinate glass formed body is made of a resinate or a mixture of resinates and forms an inorganic oxide or a mixed oxide or a mixture of oxides of glass shape by firing in air.