To provide a composition which is used for peeling organic coating films, enables treatments for peeling the organic films at a low temperature of about 60 to 70°C, hardly evaporates the solvents of the peeling liquid, scarcely changes the solvent ratio of the composition during a peeling operation, has a general purpose property, does not dissolve glass substrate, and is advanta geous from safety against fires.

This composition for peeling organic coating films comprises 5 to 90 wt.% of a polar solvent, 0.1 to 90 wt.% of ethylene amine, and 0.01 to 30 wt.% of a quaternary ammonium compound. The composition for peeling the organic coating films can peel the organic coating films at a low temperature such as 50 to 70°C and can be applied to the regeneration of glass substrates for liquid crystal displays and the like.