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Title:
COMPOSITION FOR PHOTORESIST OVERCOATING AND METHOD OF FORMING PHOTORESIST PATTERN USING THE SAME
Document Type and Number:
Japanese Patent JP2001166489
Kind Code:
A
Abstract:

To provide a technique of forming a photoresist pattern so that a vertical pattern can be formed even when the absorbance of a photoresist resin to the light source is relatively high.

The composition for a photoresist overcoating contains (I) a resin for the photoresist overcoating, (ii) a solvent and (iii) a basic compound. The obtained composition is used for the method of forming a photoresist pattern.


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Inventors:
JUNG JAE CHANG
KONG KEUN-KYU
KO JIGEN
KIN CHINSHU
HAKU KIKO
Application Number:
JP2000368612A
Publication Date:
June 22, 2001
Filing Date:
December 04, 2000
Export Citation:
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Assignee:
HYUNDAI ELECTRONICS IND
International Classes:
G03F7/004; G03F7/039; G03F7/11; H01L21/027; (IPC1-7): G03F7/11; H01L21/027
Domestic Patent References:
JPH1069091A1998-03-10
JPH1010743A1998-01-16
JPH0757990A1995-03-03
JPH07295210A1995-11-10
JPH0815859A1996-01-19
JPH05188598A1993-07-30
JPH0971765A1997-03-18
JPH11349857A1999-12-21
JPH07295228A1995-11-10
JPH08305022A1996-11-22
Attorney, Agent or Firm:
Eiji Saegusa (8 others)



 
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