To suppress a decrease in a polishing rate to the minimum regardless of long-term polishing service.
In a composition for polishing, a spheroidal particle whose sphericity is 0.9 or larger and 1.0 or smaller and a non-spheroidal particle whose sphericity is 0.3 or larger and less than 0.9 are dispersed in a water-based dispersive medium, and the weight ratio of the spheroidal particle to the non-spheroidal particle ranges from 2/98 to 35/65. The spheroidal particle and non-spheroidal particle are made of silica particles, the average grain size of the spheroidal particle ranges from 20 to 150 nm, and that of the non-spheroidal particle ranges from 5 to 100 nm. The pH of the composition for polishing ranges from 8 to 11.5, and the amount of basic impurities contained in the composition for polishing is 100 ppm or smaller to SiO2.
NISHIDA HIROYASU
KOMATSU MICHIO
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