Title:
封止成形材料用組成物及び電子部品装置
Document Type and Number:
Japanese Patent JP6794218
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for a sealing molding material capable of giving a cured product having a high glass transition temperature (Tg), excellent moldability, and good adhesion to a semiconductor insert component, and to provide an electronic component device using the composition for a sealing molding material.SOLUTION: The composition for a sealing molding material contains (A) a maleimide resin represented by general formula (I), (B) a phenolic curing agent having a triphenylmethane skeleton and/or a naphthalene skeleton, (C) an alkoxysilane containing a secondary amine, (D-1) an organophosphorus curing accelerator, and (D-2) an imidazole curing accelerator. The content of the component (B) is 10-50 pts.mass based on 100 pts.mass of the component (A).SELECTED DRAWING: None
Inventors:
Naoki Watanabe
Shinetsu Fujieda
Shinetsu Fujieda
Application Number:
JP2016210615A
Publication Date:
December 02, 2020
Filing Date:
October 27, 2016
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/29; C08K5/3445; C08K5/49; C08K5/544; C08L61/10; C08L61/30; C08L65/00; H01L23/31
Domestic Patent References:
| JP2016044211A | ||||
| JP6132426A | ||||
| JP2005154739A | ||||
| JP5043659A |
Attorney, Agent or Firm:
Makoto Kataoka
Arinaga Shun
Hayakawa Miwa
Arinaga Shun
Hayakawa Miwa