To provide a compound suitable as an acid-forming agent for a resist composition, the acid-forming agent consisting of the compound, the resist composition containing the acid-forming agent, and a method for forming a resist pattern by using the resist composition.
This compound is expressed by general formula (b1-6), the acid-forming agent consists of the compound, the resist composition comprises a substrate material component (A) changing its alkali solubility by the action of the acid, and the acid-forming agent component (B) forming the acid by being exposed with light, wherein, the acid-forming component (B) comprises an acid-forming agent (B1) consisting of the acid-forming agent expressed by the general formula (b1-6) [wherein, R40 is an alkyl; R41 to R43 are each independently an alkyl, an acetyl, carboxy or a hydroxyalkyl; (n0) is an integer of 1 to 3; (n1) is an integer of 0 to 3; (n2), (n3) are each independently an integer of 0 to 3; and X- is an anion].
KAWAKAMI AKINARI
Masatake Shiga
Masakazu Aoyama
Suzuki Mitsuyoshi
Noriko Yanai