Title:
COMPOSITE COPPER PARTICLE
Document Type and Number:
Japanese Patent JP2017218649
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper particle having enhanced moisture resistance and heat resistance.SOLUTION: The composite copper particle has a core particle of copper, a layer of copper tin alloy arranged thereon and a silver layer arranged thereon. It is preferable that oxygen percentage content after storing the composite copper particle under 85°C and 85%RH environment over 500 hours is 1.5 mass% or less. It is also preferable that oxygen percentage content after storing the same under 125°C environment over 500 hours is 1.5 mass% or less. It is also preferable that the alloy is a CuSn, CuSnor CuSn alloy.SELECTED DRAWING: Figure 1
More Like This:
| JP5774201 | New compound semiconductors and their utilization |
| JP7391678 | Bonding material |
| JP2008303414 | FINE POWDER |
Inventors:
AOKI SHINJI
FUJIMOTO TAKU
SASAKI TAKASHI
MORI HIROKI
FUJIMOTO TAKU
SASAKI TAKASHI
MORI HIROKI
Application Number:
JP2016115710A
Publication Date:
December 14, 2017
Filing Date:
June 09, 2016
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO
International Classes:
B22F1/00; B22F1/02; H01B1/00; H01B1/22; H01B5/00
Attorney, Agent or Firm:
Showa International Patent Office