Title:
COMPRESSION MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP2023058834
Kind Code:
A
Abstract:
To provide a compression molding apparatus capable of improving productivity, preventing the occurrence of molding defects caused by adhesion of foreign matter, and improving molding quality.SOLUTION: A compression molding apparatus 1 for the present invention uses a sealing mold 202 with three sets of cavities 208 in one of an upper mold 204 or a lower mold 206 and three sets of work holding parts 205 corresponding to the other, to seal three or less workpieces W in a lump with resin R. A workpiece supply unit 100A, a press unit 100B, a resin supply unit 100C, and a molded product storage unit 100D are arranged in this order along a predetermined X direction. Otherwise, the workpiece supply unit 100A, the press unit 100B, the resin supply unit 100C, the press unit 100B, and the molded product storage unit 100D are arranged in this order along the predetermined X direction.SELECTED DRAWING: Figure 1
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Inventors:
TAGAMI SHUSAKU
YANAGISAWA MAKOTO
YANAGISAWA MAKOTO
Application Number:
JP2021168583A
Publication Date:
April 26, 2023
Filing Date:
October 14, 2021
Export Citation:
Assignee:
APIC YAMADA CORP
International Classes:
B29C43/34; B29C43/18; H01L21/56
Attorney, Agent or Firm:
Watanuki International Patent & Trademark Office
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