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Title:
COMPUTER SYSTEM PROVIDED WITH FLEXIBLE SUBSTRATE
Document Type and Number:
Japanese Patent JPH05241684
Kind Code:
A
Abstract:

PURPOSE: To improve performance, and also, to reduce computer size by arranging and piling flexible function islands adjacently to each other, and connecting them electrically.

CONSTITUTION: A planar 30 which is added with the memory function of the computer and is of sufficiently reduced size is added with another computer function island 18. A memory controller 12 is arranged on the uppermost layer of the plural memory function islands 14 piled adjacently. A memory chip 15 is interconnected electrically and also arranged mechanically on a module 14 with a flexible substrate member 36. The memory controller 12 is arranged on the planar 30, and is connected to the planar 30 by an electric connecting means 32. Each module 14 is attached with the memory chip 15 interconnected to the memory controller through the substrate 36.


Inventors:
SUTEFUAN AASAA KAATEISU
RONARUDO UOOKAA GIDONII
GASUTABU SHIYUROTSUKE
Application Number:
JP28845192A
Publication Date:
September 21, 1993
Filing Date:
October 27, 1992
Export Citation:
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Assignee:
IBM
International Classes:
G06F15/76; H01L23/538; H05K1/00; G06F1/18; H05K1/18; H05K7/20; H05K1/11; H05K3/00; H05K3/46; (IPC1-7): G06F1/18; G06F15/76; H05K1/00
Domestic Patent References:
JPS5952687U1984-04-06
JPS6452033U1989-03-30
Attorney, Agent or Firm:
Koichi Tonmiya (4 outside)