To provide a condenser microphone manufacturing method that is suitable for noise elimination and production of a subminiature product by directly bonding an FET chip formed in each cell of a wafer onto a pattern of a printed circuit board thereby to preventing the defect of a broke FET terminal.

The wafer is divided into cells of a prescribed size, a FET chip 32 is formed to each cell, the FET chip is fixed to a corresponding position of a printed circuit board 31 with a conductor print pattern, the drain, source, gate terminals formed to the bottom of the FET chip and the corresponding parts of the printed circuit board are bonded by using metallic wires, the surface of the printed circuit board with the FET chip is molded, the operating state is tested, and a vibration ring 37, a diaphragm, a spacer 35, a support 33, a rear pole plate 34, a connection ring 40 contained in the case 38 and the printed circuit board to which the FET is bonded are sequentially coupled as a feature.