Title:
CONDUCTING PATH AND WIRE HARNESS
Document Type and Number:
Japanese Patent JP2015082865
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To perform bending deformation of a conducting path without burdening an operator with a load.SOLUTION: A wire harness Wa is structured by a bundled coated cable 13 in a form that a metal conductor 14 is enclosed by an insulation coating 15. On the outer periphery of the coated cable 13, a supporter 18 of a photo-curing resin is provided for holding the coated cable 13 in a predetermined shape. Because a conducting path 10 constituting the wire harness Wa is held in the predetermined shape by the supporter 18 of the photo-curing resin provided on the outer periphery of the coated cable 13, it is unnecessary for the operator to manually perform bending deformation of the conducting path 10 (wire harness Wa) against the rigidity of the conductor 14.
Inventors:
MIZUNO YOSHIMASA
OMORI YASUO
HIRAI HIROKI
TABATA MASAAKI
KAMISATO MANABU
OMORI YASUO
HIRAI HIROKI
TABATA MASAAKI
KAMISATO MANABU
Application Number:
JP2013218536A
Publication Date:
April 27, 2015
Filing Date:
October 21, 2013
Export Citation:
Assignee:
AUTO NETWORK GIJUTSU KENKYUSHO
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H02G3/04; H01B7/00; H05K7/02
Domestic Patent References:
| JP2009104889A | 2009-05-14 | |||
| JPS6321114A | 1988-01-28 |
Attorney, Agent or Firm:
Patent Business Corporation Grund Patent Office
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