CONDUCTIVE ADHESIVES, AND MOUNTED STRUCTURE USING THE SAME

Japanese Patent JP3450839

B2

PROBLEM TO BE SOLVED: To provide a conductive adhesives and a mounted structure using the same which maintain a moisture resistant reliability even when an ordinary base metal electrode is used.
SOLUTION: The conductive adhesives contains the first particle of which a standard electrode potential is higher than the standard electrode potential of silver, and the second particle of which a standard electrode potential is lower than the standard electric potential of silver. On the surface of the electrode with a potential lower than the potential of metal particle, which is the first particle, a metal compound film, with a potential higher than the potential of the metal particle, may be formed.

WO/2003/098745	METHOD OF ATTACHING CIRCUITRY TO A MODULAR JACK CONNECTOR USING ELECTRICALLY CONDUCTIVE PASTE
JPH09172236	PRINTED-WIRING BOARD
JPS60149671	FORMATION OF ELECTROCONDUCTIVE COATING

Hiroki Takezawa
Takashi Kitae
Yukihiro Ishimaru
Power Mitani
Tosaku Nishiyama
Shinji Kobayashi

JP2001203630A

September 29, 2003

July 04, 2001

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Matsushita Electric Industrial Co., Ltd

H05K1/09; H01B1/00; H01B1/22; H01L21/60; H05K3/32; H05K3/34; (IPC1-7): H01B1/22; H01B1/00; H01L21/60; H05K1/09; H05K3/32; H05K3/34

JP2000133043A
JP10190239A
JP5282954A
JP7254308A
JP1154880A
JP200022023A

【文献】Daoqiang Lu and C.P.Wong Quinn K.Tong,Mechanisms Underlying the Unstable Resistance of Conductive Adhesives,1999 Electronic Components and Technology Conference,p.342~346
【文献】Daoqiang Lu Quinn K.Tong and C.P.Wong,Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives,IEEE TRENSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING,VOL.22,NO.3,JULY 1999,p.228~232

Ikeuchi, Sato & Partners

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