Title:
CONDUCTIVE BALL MOUNTING METHOD
Document Type and Number:
Japanese Patent JP3228140
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To establish a conductive ball mounting method to allow mounting of conductive balls, which are vacuum sucked to the undersurface of a suction head, on a pad of a work at a high speed.
SOLUTION: A suction head 21 makes vacuum suction of each conductive ball 1 to a suction hole 23 and mounts it on a pad 12 of a work 11. The internal space 22 of the suction head 21 is connected to the suction part 24 through the first valve 25 and further connected to a high pressure air supply part 28 through the second valve 29. A third valve 30 and a fourth valve 31 for vacuum destruction are connected to the space 22. The suction head 21 sinks to allow the ball 1 to ground on the pad 12 and then rises, when the second valve 29 should be opened to put the space 22 in a positive pressure so that the vacuum state is destructed, and then the third valve 30 and fourth valve 31 are opened to put the space 22 in the atmospheric pressure. Thereby the ball 1 separates from the suction hole 23 certainly and is mounted on the pad 12.
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Inventors:
Tadahiko Sakai
Shoji Sakemi
Shoji Sakemi
Application Number:
JP21702196A
Publication Date:
November 12, 2001
Filing Date:
August 19, 1996
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23P19/00; B23K3/06; B23P19/04; B23P21/00; B25J15/06; B65G47/91; H01L21/48; H01L21/60; H05K3/34; (IPC1-7): H05K3/34; B23K3/06; B25J15/06; B65G47/91; H01L21/60
Domestic Patent References:
| JP864944A | ||||
| JP7251263A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)