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Title:
導電性組成物、該導電性組成物を用いた硬化体及び積層体
Document Type and Number:
Japanese Patent JP6992582
Kind Code:
B2
Abstract:
To provide a conductive composition with less formation of a film in air exposure and with a favorable levelling property in application of the conductive composition to a base material, wherein the conductivity of a cured body cured at a relatively low temperature is high, and the smoothness of the cured body is excellent.SOLUTION: The conductive composition includes (b) 10 to 40 pts.mass of a thermosetting resin, (c) 0.5 to 2 pts.mass of an aromatic amine compound represented by the following Formula (I), and (d) 0.05 to 1.3 pts.mass of at least one metal salt of a fatty acid, selected from the group consisting of zinc salts of fatty acids having 12 to 24 carbon atoms and magnesium salts of the fatty acids, with respect to (a) 100 pts.mass of copper particles. In the conductive composition, a blending ratio ((c)/(d)) between the above (c) and (d) is 1 to 20.SELECTED DRAWING: None

Inventors:
Yasunori Tagami
Naoshi Takahashi
Takuya Qingdao
Application Number:
JP2018027826A
Publication Date:
January 13, 2022
Filing Date:
February 20, 2018
Export Citation:
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Assignee:
NOF CORPORATION
International Classes:
C08L101/00; B32B7/025; B32B27/42; C08K3/105; C08K5/098; C08K5/18; C08L61/06; C09D5/24; C09D7/47; C09D7/61; C09D161/06; C09D201/00; H01B1/22; H01B5/14
Domestic Patent References:
JP2013115004A
JP7062274A
JP2016183270A
JP2015049988A
JP2017186605A
Foreign References:
WO2016199811A1
Attorney, Agent or Firm:
Masahiro Taguchi
Shigeo Torayama
Hiroshi Chichimatsu



 
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