Title:
CONDUCTIVE COMPOSITION AND FLEXIBLE CONDUCTIVE MATERIAL
Document Type and Number:
Japanese Patent JP2002140930
Kind Code:
A
Abstract:
To provide a conductive composition having satisfactory flexibility, excellent stability when blending and storing, and satisfactory transparency, smoothness, and electric conductivity and provide a flexible conductive material preventing the reduction of electric conductivity due to a crack even if a soft basic material is expanded, shrunk, and deformed.
The conductive composition containing water soluble conductive polymer having a sulfonic acid group and/or carboxyl group, vinyl polymer emulsion B having a glass-transition temperature of 40°C or less, and solvent and the flexible conductive material on which the conductive composition is applied are provided.
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Inventors:
UZAWA MASASHI
SAITO TAKASHI
SAITO TAKASHI
Application Number:
JP2000334720A
Publication Date:
May 17, 2002
Filing Date:
November 01, 2000
Export Citation:
Assignee:
MITSUBISHI RAYON CO
International Classes:
C08L29/04; C08F2/44; C08F265/02; C08L51/00; C08L65/00; C08L71/02; C08L79/00; C08L101/00; C08L101/14; H01B1/12; H01B1/20; H01B5/14; (IPC1-7): H01B1/20; C08F2/44; C08F265/02; C08L29/04; C08L51/00; C08L65/00; C08L71/02; C08L79/00; C08L101/00; C08L101/14; H01B1/12; H01B5/14