Title:
CONDUCTIVE COMPOSITION AND HEAT INSULATING CONDUCTIVE MEMBER
Document Type and Number:
Japanese Patent JP2015044908
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat insulating conductive member which has excellent conductivity and mechanical characteristics and also heat insulating property, especially a small thermal conductivity in the penetration direction even if it has a flat plate shape, and to provide a method for producing the same.SOLUTION: A conductive composition contains: 100 pts.mass of resin beads A having a thermal conductivity of 0.5 W/m K or less and an average particle diameter of 50-500 μm; and a conductive material B in a specific ratio, which is selected from the group comprising particles whose average particle diameter is smaller than that of the resin beads A and is 1 nm to 200 μm and fibers whose average fiber diameter is smaller than the average particle diameter of the resin beads A and is 1 nm to 200 μm.
Inventors:
AKINAGA HIROSHI
IINO TADASHI
IZUMI ZENICHIRO
IINO TADASHI
IZUMI ZENICHIRO
Application Number:
JP2013175742A
Publication Date:
March 12, 2015
Filing Date:
August 27, 2013
Export Citation:
Assignee:
SHOWA DENKO KK
International Classes:
C08L101/12; C08K7/02; C08K7/16