To provide a conductive particle which, when a connection structure is obtained by connecting between electrodes, can reduce connection resistance between the electrodes and suppress increases in connection resistance under high temperature and high humidity.

A conductive particle 1 according to the present invention includes a base material particle 2 and a conductive layer 3 disposed on the surface of the base material particle 2. The conductive layer 3 includes nickel and a component of at least one metal selected from tungsten and molybdenum. The nickel content in 100 wt.% of the whole conductive layer 3 is 60 wt.% or more. The total content of tungsten and molybdenum in 100 wt.% of a conductive layer section having a thickness of 5 nm from the outer surface of the conductive layer 3 inward in the thickness direction is above 5 wt.%.