Title:
CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2015118931
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive particle capable of making initial connection resistance low when a connection structure is obtained by electrically connecting electrodes by the conductive particle, and capable of maintaining connection resistance low even when the connection structure is exposed in a presence of acid.SOLUTION: The conductive particle 1 has a substrate particle 11, a first conductive layer 12 arranged on a surface of the substrate particle 11 and formed from silver or copper, a second conducive layer 13 arranged on an outside surface of the first conductive layer 12 and formed from nickel and a plurality of core material 14 formed by an inorganic material containing no nickel, the second conductive layer 13 has a plurality of projections 13a on an outside surface, the core material 14 is arranged inside of the projections 13a and the projections 13a is formed by protuberance of the outside layer of the second conductive layer 13 by the core material 14.
Inventors:
O GYOKA
Application Number:
JP2014233609A
Publication Date:
June 25, 2015
Filing Date:
November 18, 2014
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01B5/00; H01B1/00; H01B1/22; H01R11/01
Domestic Patent References:
| JP2013214509A | 2013-10-17 | |||
| JP2013206823A | 2013-10-07 |
Foreign References:
| WO2013146573A1 | 2013-10-03 | |||
| WO2013094636A1 | 2013-06-27 | |||
| WO2013108740A1 | 2013-07-25 | |||
| WO2012014925A1 | 2012-02-02 |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office