Title:
CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2015118932
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive particle capable of making initial connection resistance low when a connection structure is obtained by electrically connecting electrodes by the conductive particle, and capable of maintaining connection resistance low even when the connection structure is exposed in a presence of acid.SOLUTION: The conductive particle 1 has a substrate particle 11, a first conductive layer 12 arranged on a surface of the substrate particle 11 and formed from silver or copper and a second conducive layer 13 arranged on an outside surface of the first conductive layer 12 and formed from nickel, the second conductive layer 13 has a plurality of projections 13a on an outside surface and average height of the projections 13a is larger than thickness of a part having no projections 13a of the second conductive layer 13.
Inventors:
O GYOKA
Application Number:
JP2014233610A
Publication Date:
June 25, 2015
Filing Date:
November 18, 2014
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01B5/00; C22C19/03; C22C19/05; H01B1/00; H01B1/22; H01R11/01
Domestic Patent References:
| JP2006228474A | 2006-08-31 | |||
| JP2013175453A | 2013-09-05 |
Foreign References:
| WO2013146573A1 | 2013-10-03 | |||
| WO2008140094A1 | 2008-11-20 | |||
| WO2012014925A1 | 2012-02-02 | |||
| WO2009008383A1 | 2009-01-15 |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office