Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONDUCTIVE PARTICLE WITH INSULATING PARTICLES, METHOD OF PRODUCING CONDUCTIVE PARTICLE WITH INSULATING PARTICLES, ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2012094529
Kind Code:
A
Abstract:

To provide conductive particles with insulating particles where the insulating particles are less susceptible to detachment from the surface of the conductive particle, and to provide a method of producing conductive particles with insulating particles.

A conductive particle 1 with insulating particles includes a conductive particle 2 having a conductive layer 5 on the surface 2a, and insulating particles 3 adhering to the surface 2a of the conductive particle 2. The insulating particle 3 has a hydroxyl group bonded directly to a phosphorus atom, or a hydroxyl group bonded directly to a silicon atom on the surface 3a thereof. In the method of producing conductive particles with insulating particles, insulating particles 3 each having a hydroxyl group bonded directly to a phosphorus atom, or a hydroxyl group bonded directly to a silicon atom on the surface 3a thereof are made to adhere to the surface 2a of the conductive particle 2.


Inventors:
UENOYAMA SHINYA
OBARA SEITARO
Application Number:
JP2011273987A
Publication Date:
May 17, 2012
Filing Date:
December 15, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01B5/00; H01B1/20; H01B5/16; H01B13/00; H01R11/01
Domestic Patent References:
JP2004241489A2004-08-26
JP2005187637A2005-07-14
JP2009135086A2009-06-18
JP2009102731A2009-05-14
Foreign References:
WO2008047600A12008-04-24
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office



 
Previous Patent: PHOTOELECTRIC SWITCH

Next Patent: ELASTIC CONTACT