Title:
CONDUCTIVE PASTE AND CONDUCTIVE FILM
Document Type and Number:
Japanese Patent JP2017216168
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive paste that can form a conductive film having excellent bending resistance and moisture resistance.SOLUTION: A conductive paste contains (A) a polyester resin with a glass transition point of less than 40°C; (B) an ethylene-vinyl acetate copolymer; and (C) a conductive filler, with the content of (B) component being 10-90 mass% relative to the total content of (A) component and (B) component.SELECTED DRAWING: None
Inventors:
ENDO SATORU
HITOSHI MAFUNE
SUZUKI TAKASHI
HITOSHI MAFUNE
SUZUKI TAKASHI
Application Number:
JP2016109770A
Publication Date:
December 07, 2017
Filing Date:
June 01, 2016
Export Citation:
Assignee:
THREE BOND CO LTD
International Classes:
H01B1/22; H01B1/00; H01B5/14; H05K1/09; H05K3/12